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1996 |
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Wednesday, May 05, 2010, Olivia Room 9:20 AM Modeling and Simulation 1 |
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Effect of ambient pressure on dynamic wetting/heat transfer at interface between molten droplet and substrate surface |
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Masahiro Fukumoto* / Toyohashi University of Technology, Japan Kazuhiro Tanaka / Toyohashi University of Technology, Japan Kun Yang/ Toyohashi University of Technology, Japan Takashi Usami/ Toyohashi University of Technology, Japan Motohiro Yamada/ Toyohashi University of Technology, Japan Toshiaki Yasui/ Toyohashi University of Technology, Japan |
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Understanding on the dynamic wetting in thermal spray process is one of the key issue for the researchers in this academic field. Up to today, I have done many experiments to clarify the effect of substrate temperature on the flattening behavior of thermal sprayed particles. Based on the results obtained, I have shown that thermal spray process can be effectively controlled by introducing a critical substrate temperature, named as Transition temperature, Tt. Additionally, I found that the similar effect was given by changing an ambient pressure. In this paper, I would like to discuss on the effect of ambient pressure on dynamic wetting/heat transfer at interface between molten droplet and substrate surface. I focused on the freely fallen experiments by using molten metal droplet instead of the actual thermal spraying. |