Abstract No.:	2019
Scheduled at:	Tuesday, May 04, 2010, Hullet Room 9:00 AM Cold Spraying 3
Title:	Potential of cold gas spraying in power electronic applications
Authors:	Kerstin-Raffaela Ernst* / Helmut-Schmidt-University University of the Federal Armed Forces Hamburg Institute of Materials Technology, Germany Frank Gärtner / Helmut Schmidt University / Institute of Materials Technology, Germany Thomas Klassen/ Helmut Schmidt University / Institute of Materials Technology, Germany
Abstract:	Potential of Cold Gas Spraying in power electronic applications Kerstin-Raffaela Donner, Frank Gaertner, Thomas Klassen Helmut Schmidt University, Hamburg, Germany Cold gas spraying enables the deposition of metallic coatings with very low oxygen content and therefore high electric and thermal conductivity. In the past, this technique was extensively used on metallic substrates. Fabrication of metallic layers on brittle substrates like ceramics is still a challenge, but could open new industrial application areas for this relatively young thermal spraying technology. This presentation gives several examples for the possible usage of cold gas spraying in the fabrication process of power electronic components. The aim is the improvement or even elimination of soldered connections, as they often cause defects because of the mismatch in thermal expansion coefficients. In this presentation, cold gas spraying of copper on Al2O3 substrates of about 200µm thickness is discussed. Different strategies for activating the substrate to increase the bonding strength are presented.

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