Abstract No.:	839
Scheduled at:	Poster Presentation Mikro- und Nanotechnologie Micro- and nanotechnologies
Title:	New Solders for Microjoints in the Medical and Aerospace Areas
Authors:	Stefania Ferrara* / Institut für Oberflächentechnik , DE Kirsten Bobzin / Surface Engineering Institute, RWTH Aachen University, Deutschland Erich Lugscheider/ Surface Engineering Institute, RWTH Aachen University, Deutschland Stefania Ferrara/ Surface Engineering Institute, RWTH Aachen University, Deutschland Felix Ernst/ Surface Engineering Institute, RWTH Aachen University, Deutschland Jürgen Rösing/ Surface Engineering Institute, RWTH Aachen University, Deutschland Janika Boltz/ Surface Engineering Institute, RWTH Aachen University, Deutschland Tatyana Kashko/ Surface Engineering Institute, RWTH Aachen University, Deutschland
Abstract:	Microsystem engineering is one of the world?s key technologies for this decade. From electronics to aerospace, from chemistry to optics, from biology to medicine, nowadays microsystems find their application in a plurality of science and technology areas. Currently, hybrid microsystems gain even more importance on the market. These micro assemblies are able to combine in the same microstructure different characteris-tics and functions of various materials, like ceramics, metals, silicon and glasses. The big challenge, to combine dissimilar materials, requires the application of a proper joining technology. In this study, the use of new joining processes and solders for microsystems have been investigated for two particular technological areas: medicine and aerospace. The two joining processes Transient Liquid Phase (TLP) Bonding and Active Soldering have been considered. Two different gold based and one nickel based solders have been developed, investi-gated and optimised according to the specific requirements of the medicine and aerospace fields. The gold based solder systems have been investigated for the medical area, where a high compatibility is necessary for all the applied materials. Moreover, the soldered microcomponents must have a high stability in corrosive media with similar features as human body fluids. A nickel/tin solder system has been investigated for aerospace applications. Despite the low soldering temperature enabling low thermal stresses and low energy expenses, the formed microjoints show a re-melting temperature considerably higher than the soldering one.

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