Thermal Spray:
Global Solutions for Future Applications

May 03 - 05, 2010            Raffles City Convention Centre, Singapore
     

ITSC SPONSORS:

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Location

Welcoming
Address

Time Schedule

Technical Program Young Scientists

Poster Session

Exposition


General Information Social Event

Reservation Forms
 - for Hotels (.pdf)
- for Hotels (link)

Contacts

ITSC MEDIA SPONSORS:

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DVS-Website
Imprint


ITSC Young Scientists

The organizers of ITSC (German Welding Society, ASM International – Thermal Spray Society and IIW-International Institute of Welding) are involved increasingly in the support of students and university graduates. Besides, it is a matter not only to invite young scientists to ITSC, but to provide them attractive offers and opportunities for an engaged co-operation and to step forward in the worldwide Thermal Spray Circus.

With the ITSC 2010 in Singapore, interested up-and-coming researchers are invited to a technical dialog and to lecture their latest results.

Short Presentation Competition!
5 Slides, 5 Minutes!
Audience Jury!
Best Presentation Junior Award at the Banquet!

Junior Session Schedule


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Organizers:


DVS - Deutscher Verband für Schweißen und verwandte Verfahren e. V.
ASM International - Thermal Spray Society (TSS)
IIW International Institute of Welding